At Target Corporation we are ready, willing and capable of working on various applications serving military and aerospace sectors and beyond with multiple technologies in order to get your project done whether it involves engineering, production, assembly, testing and/or repair.

  • Capable of placing BGA, µBGA, QFN and bulk/odd-form devices
  • Can accommodate QFP spacing as fine as 12mil
  • Maximum board size 18” x 22”
  • Tray tower in place for increased capacity and production flexibility
  • Multiple feeder banks for “on-the-fly” changeovers
  • Multi-function, dual head placement
  • Capable of placing 0201 chips to 55mm x 55mm devices at full speed
  • Chip placement rates up to 16,500 cph (chips per hour)
  • Unique product-specific programs for all assemblies to ensure optimal solderability
  • Dedicated conformal coating room
  • Spray booth for UR coating application
  • 100% blacklight inspection for all sprayed units
  • Programmed spray of AR coating (UV coating can be automatically sprayed depending on board layout and geometry)
  • Unique product-specific programs for all assemblies to ensure optimal solderability
  • Lambda wave nozzle
  • Full weekly maintenance performed to factory specifications
  • Unique wash programs based upon customer cleanliness requirements
  • Onboard cleanliness testing and SPC capabilities
  • Kyzen Aquanox a4241 detergent employed (qualified to remove Indium and Alpha flux deposits)
  • Fully programmable and capable of cutting 8-32AWG wire.
  • Maximum output: 10,000/hr.
  • DEK Horizon 03i Screen Printer
  • Universal Advantis X
  • Universal VCD/Sequencer
  • Plato Model SP-500T Solder Pot (2)
  • GPD CF-8 and CF-9 Component Formers
  • Hepco Through-Hole Lead Trimmer w/multiple trim plates
  • Q Corporation 2000 Series QRG Automated Lead Trimmer
  • Plato Model SP-500T Solder Pot (2)
  • Molex TM2000 Crimper
  • Huskie Robo Crimp REC-3510
  • Hanson Rivet 6000CS Rivet/Press Fit Machine
  • EFD Ultra 2400 Series Glue/Adhesive Dispenser
  • Brady 3481 Label Printers (2; Product Traceability)
  • Zebra 170X:4 Label Printer (Inventory Control)
  • Gold Count Axial and Radial Tape Marker
  • Speeds of 5-6.3+in^2/sec (41+cm^2/sec).
  • Optical Character Verification and Recognition (OCV and OCR).
  • 20” x 20” (510mm x 510mm) board size capability.
  • 4.1 mega-pixel digital camera.
  • 19µm per pixel resolution (scaleable).
  • Standalone SPC program for constant process monitoring.
  • State of the art Flying Probe technology.
  • Extreme accuracy; able to probe parts as small as 01005.
  • Linear motors on all 3 axes (X, Y, Z).
  • Probes moved without mechanical friction for maximum probing repeatability.
  • Intuitive programming software to reduce set-up time.
  • Agilent 3070 ICT.
  • Hot/Cold/Vibration Test Chambers.
  • Hipot Testing.
  • Cirris Wire Continuity Tester.
  • Alphatron PT-100A Pull Tester.
  • HP-100 Digital Torque Meter.
  • Luxo (2.5x) Halo Magnifiers.
  • Sciencescope SSZ Microscopes.
  • Bausch and Lomb Microscopes.
  • Loner 951SX Soldering Stations.
  • Hakko FX-951 Soldering Stations.
  • Desco Benchtop Ionizers.
  • Zephyrtronics Pre-heat Stations.
  • Pace ST115 Repair Station.
  • Pace MBT350 Repair Station.
  • Desco Combo Wrist Strap/Footwear Tester.
  • 3M 746 Wrist Strap Tester
  • Static Shield Bag Tester 3M 709
  • Aqueous Zero Ion Ionic Contamination Tester.
  • Various test and diagnostic test instruments including spectrum analyzers, oscilloscopes, multimeters, RF signal generators, volt meters, network analyzers, attenuators, high voltage probes and power meters.
We have distinguished ourselves by doing whatever it takes to meet a client’s needs and a project’s requirements. When it comes right down to it, we’re not just delivering product we’re delivering value.

In addition to customer service, our capabilities include:

  • Systems
  • Box Builds
  • Wire Harness Assemblies
  • Cable Assemblies
  • RF Manufacturing
  • RF Repair
  • High Voltage Manufacturing
  • High Voltage Repair